PART |
Description |
Maker |
CT1210KXXG |
Multilayer technology
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EPCOS
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PIC18F4580-I_ML PIC18F4580-I_P PIC18F4580-I_PT PIC |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
PIC18F4680 PIC18F2585 PIC18F2585_07 PIC18F2680 PIC |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
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0907X7R104Z2FB 0907X7R104Z2F4 0907X7R104Z2F5 0907X |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.1 uF, SURFACE MOUNT, 0907 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.00082 uF, SURFACE MOUNT, 0704 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0082 uF, SURFACE MOUNT, 1706 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.082 uF, SURFACE MOUNT, 3439 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.00068 uF, SURFACE MOUNT, 0704 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.06 uF, SURFACE MOUNT, 2725 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 0.68 uF, SURFACE MOUNT, 1706 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.068 uF, SURFACE MOUNT, 0907 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0068 uF, SURFACE MOUNT, 0704 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.68 uF, SURFACE MOUNT, 2321 CHIP
|
Presidio Components, Inc.
|
B72587E3140S200 B72588G3140S200 B72547E3140S200 SR |
Combination of a multilayer ceramic capacitor and a multilayer varistor, leaded
|
EPCOS[EPCOS]
|
PIC18F4585-P PIC18F4585-I |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
1206J6300180KCT 1206J6300180KCR 1206J6300101KCR 12 |
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000018 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000015 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000022 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00015 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.001 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00018 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000012 uF, SURFACE MOUNT, 1206 CHIP CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000018 uF, SURFACE MOUNT, 1206 CHIP
|
Syfer Technology, Ltd.
|
PIC18F4680 PIC18F4585 PIC18LF4680-I301 PIC18LF4680 |
Enhanced Flash Microcontrollers with ECAN? Technology, 10-Bit A/D and nanoWatt Technology Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
HDG320240 320240 |
Chip On Glass technology 320 X 240 Dots Graphics Chip On Glass technology 在玻璃芯片技
|
List of Unclassifed Manufacturers ETC[ETC] Hantronix,Inc Electronic Theatre Controls, Inc.
|
C281P1.5UF20200V C282P1.5UF10200V C285P1.2UF10500V |
CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 2825 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 3333 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.2 uF, SURFACE MOUNT, 6560 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.2 uF, SURFACE MOUNT, 4040 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.8 uF, SURFACE MOUNT, 2825 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.8 uF, SURFACE MOUNT, 5440 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.5 uF, SURFACE MOUNT, 4040 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.2 uF, SURFACE MOUNT, 2825 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.2 uF, SURFACE MOUNT, 5440 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 1.8 uF, SURFACE MOUNT, 4040 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 1.5 uF, SURFACE MOUNT, 5440 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 11283 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 4040 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.3 uF, SURFACE MOUNT, 6560 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.9 uF, SURFACE MOUNT, 6560 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 6560 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 11283 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 3.3 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 1000 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 2.7 uF, SURFACE MOUNT, 11283 CHIP CAPACITOR, CERAMIC, MULTILAYER, 500 V, 8.2 uF, SURFACE MOUNT, 11283 CHIP CAPACITOR, CERAMIC, MULTILAYER, 1000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 10000 V, 0.01 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 3000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 2000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 3.9 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 5000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 200 V, 2.7 uF, SURFACE MOUNT, 16080 CHIP CAPACITOR, CERAMIC, MULTILAYER, 4000 V, 0.1 uF, SURFACE MOUNT, 16080 CHIP
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Agilent Technologies, Inc. Yageo, Corp. Ecliptek, Corp. SEMIKRON Alliance Semiconductor, Corp. Coilcraft, Inc. SCHURTER AG
|
SIGC156T60SNR2C |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip
|
Infineon Technologies AG
|
SIGC144T170R2C SIGC144T170R2C09 |
IGBT Chip in NPT-technology 1700V NPT technology 280 μm chip
|
Infineon Technologies AG
|
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